3M brings precision, efficiency and performance to your manufacturing process.
If you are involved in semiconductor manufacturing and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology, molding and high purity isotopic materials provide solutions which help enable the uniformity, cleanliness and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from materials used in etching and deposition, CMP and surface finishing materials for wafer processing, fluids for thermal management, tape and reel for chip transport and materials for wafer doping and ion implantation.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
Enabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
These micro-structured additives literally improve the “cool factor” of electronics by helping conduct and dissipate heat in chip components.
High performance chemicals for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.
3M CMP and surface finishing materials can help increase productivity, improve yields and provide high quality process performance.
From chemical- and temperature-resistant seals to high-purity wafer carriers, these elastomers and plastics are engineered to reduce contamination.
These tiny hollow spheres not only reduce weight, but also help improve dimensional stability in flexible polymer chips, printer consoles and more.
Glass may not seem high-tech, but these electronic glass powders are used in specialized electronics from chip components to plasma displays.
Up to 99.9999% pure, these customizable boron dopants meet or exceed industry standards for high purity, and are helping expand R&D possibilities.
Help protect your components during shipping and storage to meet your requirements and increase productivity.
The versatile product design helps enable reliable performance for test and burn-in applications.
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.
Frequent and thorough cleaning of equipment and tools used in semiconductor manufacturing is critical in order to help remove particulates and other contaminants that can lead to device failure.
Unfortunately, some conventional solvents, such as IPA and acetone, are flammable and can be damaging to certain delicate materials. And non-flammable options, such as aqueous cleaning processes, can leave residue and increase risk of corrosion. They may also require higher capital equipment and operating costs.
That’s why 3M offers non-flammable, advanced cleaning solvents to help address your performance, safety and environmental needs.